半导体激光器热特性分析研究-机械工程专业论文.docxVIP

I I 摘 要 半导体激光器的热特性问题一直是本领域研究的一个重点课题。虽然半导体激光 器具有较高的光电转换效率，但在其工作时仍然有相当部分的电能转换为了热能,从而 使器件的温度上升。随着器件温度的上升会出现激射波长红移、阈值电流增加、模式 不稳定、光电转换效率降低等现象，此外温度上升还会造成有源区各材料层间产生热 应力，而使激光器的寿命受到影响。这使得解决激光器的散热问题变得尤为重要。因 此研究半导体激光器的热特性，解决激光器的散热问题，提升器件的使用寿命具有极 其重要的现实意义。本文结合对半导体激光器封装与制备的研究和实践，运用 ANSYS 有限元分析软件对不同长度、宽度及厚度尺寸热沉的单芯片半导体激光器分别进行稳 态热分析模拟实验，探究半导体激光器热沉尺寸变化对器件热阻的影响，结合分析数 据对其内在联系进行总结。并依据分析结果提出经过优化的半导体激光器热沉散热结 构。 关键词：半导体激光器 热特性 封装制备 有限元法 热阻 II II ABSTRACT Thermal characteristics issue of semiconductor lasers has been a key topic in this field. Although a semiconductor laser has a high photoelectric conversion efficiency, It will convert electrical energy to thermal energy when it is working with the temperature of the device rising. With the rise in the temperature of the device will appear red shift of the lasing wavelength, the threshold current increases, the unstable mode, reducing the photoelectric conversion efficiency and so on. Temperature increase will cause thermal stress between each material layer in the active region, by reducing the lifetime of the laser. This shows that laser cooling issues is very important. So it is necessary to study of the thermal characteristics of semiconductor lasers, solve the lasers heat problem, enhance the life of the device. Combined with semiconductor laser packaging and preparation of practice, based on ANSYS finite element analysis software analyze heat sink for semiconductor laser with different size .The effects of heat sink for semiconductor laser thermal resistance, In order to summarize the intrinsic link, analyze and combine the date. And present new heat sink thermal structure of the semiconductor laser based on the analysis results. Key words: semiconductor laser thermal characters package preparation finite element method thermal resistance 目 录 摘 要 ABSTRACT 目 录 HYPERLINK \l _bookmark0 第一章 绪 论························································································· 1 HYPERLINK \l _bookmark1 1.1 论文研究背景和研究