反应式离子蚀刻机RIE操作手册.pdf

NCKU Micro-Nano Technology Center/Southern Region MEMS Center Page1 NCKU Micro-Nano Technology Center/Southern Region MEMS Center Page1 反應式離子蝕刻機 RIE （Reactive Ion Etching） 操作手冊 本文件及文件之內容屬國科會南區微系統研究中心所有，謹供列印閱讀，未經許可，請勿以任何形式翻製抄襲。 This document is the property of the NSC Southern Region MEMS Research Center. You are very welcome to browse and print out the document. It is extremely illegal to copy any part of this document in any forms without permission! Document Type Title Document No. Edition Editor Date SOP 反應式離子蝕刻機 RIE 12345-678 1 詹川逸 2003/6/12 NCKU Micro-Nano Technology Center/Southern Region MEMS Center Page2 NCKU Micro-Nano Technology Center/Southern Region MEMS Center Page2 目 錄 蝕刻原理 ……………………………….3 電漿反應方程式 ……………………….6 儀器廠商 ……………………………….7 機台規格……………………………….8 注意事項……………………………….9 裝置介紹………………………………10 開機步驟和操作順序 …………………14 關機步驟 ……………………………..26 參考文獻……………………………..31 本文件及文件之內容屬國科會南區微系統研究中心所有，謹供列印閱讀，未經許可，請勿以任何形式翻製抄襲。 This document is the property of the NSC Southern Region MEMS Research Center. You are very welcome to browse and print out the document. It is extremely illegal to copy any part of this document in any forms without permission! Document Type Title Document No. Edition Editor Date SOP 反應式離子蝕刻機 RIE 12345-678 1 詹川逸 2003/6/12 NCKU Micro-Nano Technology Center/Southern Region MEMS Center Page3 NCKU Micro-Nano Technology Center/Southern Region MEMS Center Page3 蝕刻原理： 在半導體製程中，蝕刻（Etch）被用來將某種材質自晶圓表面上