双层热源双层通道内流体流动与传热特性.PDF

第44卷 第3期 北 京 工 业 大 学 学 报 Vol.44 No.3 2018年 3月 JOURNAL OF BEIJING UNIVERSITY OFTECHNOLOGY Mar. 2018 双层热源双层通道内流体流动与传热特性 夏国栋,王摇 卓,马丹丹 (北京工业大学环境与能源工程学院强化传热与过程节能教育部重点实验室,北京摇 100124) 摘摇 要:为了应对集成电路中日益严峻的热问题,数值模拟了双层热源双层微通道结构内流体的流动及传热特性, 将其与单层热源单层微通道进行对比分析,发现上下通道层之间的相互影响使得上层通道加热面温度降低2 益左 右,下层通道热阻减小10%左右. 而后以减小对流热阻的角度出发,对整体结构的传热性能进行优化,在原有矩形 通道基础上布置圆形针肋以及扇形凹穴,发现此种新型通道使得下层加热面温度降低 11益左右,热阻减小,系统 性能提高. 关键词:微通道;双层;强化传热 中图分类号:TK124 文献标志码:A 文章编号:0254-0037(2018)03-0455-08 doi:10.11936/ bjutxb2017010038 Flow and Heat Transfer Characteristics in Double鄄layer Channel With Double Heat Sources XIA Guodong,WANGZhuo,MA Dandan (Key Laboratory of Enhanced Heat Transfer and Energy Conservation Ministry of Education,College of Environmental and Energy Engineering,Beijing University of Technology,Beijing 100124,China) Abstract:To deal with the increasingly severe thermal issues in integrated circuit,the flow and heat transfer characteristics of the fluid in the double鄄layer channel which have double鄄layer heat source were numerically simulated,andtheresultswerecomparedtothesinglechannelwhichhassingleheat source. Due to the interaction between the two channel layers,the heat source temperature of the upper channel and the thermal resistance of the lower channelwere reduced by about2益 and 10%,respectively. The heat transferperformancewasoptimizedbyreducingconvectivethermalresistance. Micro鄄pinfinandfan鄄 shaped reentrant cavitieswere arranged on the original rectangular channel structure. Results show that the heat sourcetemperatureofthelowerchannelisreducedabout 11益 bythenew channel. Thethermal resistance is reduced and the system performance