铜线键合技术与设备的分析与应用.pdfVIP

ABSTRACT ABSTRACT Wire bonding is one key process in the integrated circuit devices assemble, usually, the bonding wire is golden wire in the traditional assemble process. The golden wire is almost applied in all the advanced IC assemble process by its’ better conductivity, elongation and chemical stability. However, with the gold-price’s going up, the assemble process using the coppe