厚膜柔性布线的micropen系统研究-材料学专业论文.docxVIP

华中科技大学硕士学位论文摘 华中科技大学硕士学位论文 摘 要 厚膜柔性布线技术是国内外新兴的一项制作混合电路、电路制板及修复技术。其 基本的原理是先采用Micropen设备直写出厚膜图形，然后通过高温烧结或激光扫描 进行后置处理，形成导线或电路元件。 本文首先论证了厚膜柔性布线技术制作混合电路及PCB板的先进性，分析比较 了几种厚膜布线设备的布线原理及优缺点，在此基础上提出了一种Micropen的设计 新方案，并成功制作出Micropen系统，整个系统由厚膜浆料输送机构、描绘笔头、 控制系统及相应软件组成。 简述了厚膜布线简单机理及厚膜布线的评价指标，厚膜线的线宽、厚度、线形的 均匀性以及电特性是衡量厚膜布线质量的直接标准。利用Micropen设备进行直写厚 膜导电浆料的方法制各出导线，通过测试所布线的线宽及线形均匀性，分析影响布线 质量好坏的各参数之间的关系。结果表明，通过改变Micropen转速、布线速度以及 浆料粘度，可以得到不同线宽和不同电阻特性的导线。在布线质量一定的前提下，通 过Micropen电机转速与布线速度的合理匹配，可以实现高速度的布线。 关键词：厚膜电路混合电路 直写微细笔PCB板 华中科技大学硕士学位论文Abstract 华中科技大学硕士学位论文 Abstract Direct writing conductive lines On circuit board is a new technology for hybrid circuit、 thick—film circuit fabrication and repair．Its basic principle is direct writing the conductive lines on a base board by the use of a Micropen system，then transformed it to conductive lines or components by sintering it in high temperature or irradiated with Laser beam． The advantages for direct writing conductive lines on ceramic board or PCB board to prepare thick-film components are short fabrication circle，high quality ofthe components， easy modification，and low cost for small production volume．After analyszing the principle of several thick—film direct writing equipments and comparing their merits and demerits，we designed a new type of Micropen equipment，and fabricated the Micropen system successfully，which is composed device for paste transporting，direct writing pen—point， control system including hardware and software． The mechanism ofthick·film direct writing and quality evaluation standard are studied． The width，thickness，homogeneity and the electric property of the conductive lines are defined as the parameters to evaluate the quality of the conductive lines，by which we can evaluate the effect of the processing parameters such as the rotation speed of the motor， writing velocity ofthe micropen and the viscidity ofthe paste on the conductive line quality， and establish the relationship of the different parameters．The experimenta