科学研究方法与实吴文刚老师.pptVIP

科学研究方法与实践 北京大学信息科学技术学院 School of Electronics Engineering and Computer Science Peking University * 第八讲：专业期刊、会议 介绍及论文投稿 —— 微电子学专业 Cover Letters main findings significance suggested reviewers “not to review” list who have read From submission to acceptance (2a) Dear Prof. J. E. Greene, Enclosed please find our manuscript entitled “Electroless copper plating applicable for bulk-silicon micromachined RF inductor,” by Xiang Han, Wengang Wu, Yi Li, Zhihong Li, Yilong Hao and Guizhen Yan, submitted for your consideration of publication in Thin Solid Films. This manuscript reports the electroless copper plating on single crystal silicon and its application on achieving high-performance bulk-silicon micromachined RF inductor. This manuscript has not been published nor submitted for publication in any other journals or conferences before. The potential referees we can suggest are Prof. Y. Shacham-Diamand at Tel-Aviv University, Prof. Norman C. Tien at UC Davis and Prof. Darrin J. Young at CWRU, along with other experts cited in the references. …… Please direct all correspondence to Dr. Wengang Wu. Thank you very much for your kind consideration! From submission to acceptance (2b1) Dear Prof. J. E. Greene, Our manuscript with Article ID TSF_1156, submitted to the journal Thin Solid Films, has been revised. Enclosed please find: (1) an electronic copy of the main text of the revised manuscript in MS Word format in which the changes made from the previous version are underlined and figures are NOT included; (2) electronic copies of the figures in TIFF format; (3) a keywords list in PDF format. The details of the revision including the replies to the comments given by the reviewers can be found in the followed list of changes. Please direct all correspondence to Dr. Wengang Wu. From submission to acceptance (2b2) IEDM vs. EDL IEDM Comprehensive report (major report) Once a year EDL Well focused (narrow topic) Quick report (timely progress) Can I subm