电子印制电路板设计技巧.doc

电子印制电路板设计技巧 In troduction This information is presented as guidelines to the preliminary design and development stages of electronic circuits for the purpose of preventing potential electromagnetic interferenee (EMI) and electromagnetic compatibility (EMC) problems? The tips are representative of good printed circuit board (PCB) design practices and are recommended as a checklist for evaluating and selecting EMI/EMC software modeling tools. The EMI simulation of circuit boards requires the evaluation of many details such as clock frequencies, switching rates, rise/fall times, signal harm on ics, data tran sfer rates, impedances, trace loadi ng and consideration of the types and values of the various circuit components. The physical layout of the PC board and its associated metallic comp on ents are important consideratio ns. Special attention should be given to the placement and characteristics of signal source components, vias, traces, pads, board stack-up, shielded enclosures, connectors and cables. For example, as signal frequencies and clock/s witchi ng rates increase, PC board trace characteristics can become similar to those of tran smissi on lines and radiators. A PC board trace or comp on ent can become an efficient antenna at a length as small as one twentieth of a wavelength. EMI/EMC problems may be approached at the component, PC board or enclosure levels. However, it is much more efficient to deal with these problems as close to the source or susceptible victim as possible? Therefore, it is important to consider these tips as guidelines for PCB design and layout so that problems may be identified and prevented prior to actual fabrication of the equipment. Gen eral EMI controls should be applied at the circuit and box levels prior to addressing EMI at the interconnected and system levels. Digital circuits are more likely to be the source of emissions due to the handling of periodic waveforms and the fast clock/switching rates. Analog circuits are more lik