半导体制造工艺流程课件.ppt

半导体制造工艺流程;半导体相关知识;半导体元件制造过程可分为;一、晶圆处理制程 ;二、晶圆针测制程 ;三、IC构装制程 ;半导体制造工艺分类;半导体制造工艺分类;半导体制造工艺分类;;双极型集成电路和MOS集成电路优缺点;半导体制造环境要求;半导体元件制造过程;典型的PN结隔离的掺金TTL电路工艺流程;横向晶体管刨面图;纵向晶体管刨面图;NPN晶体管刨面图;1.衬底选择;第一次光刻—N+埋层扩散孔;外延层淀积;第二次光刻—P+隔离扩散孔;第三次光刻—P型基区扩散孔;第四次光刻—N+发射区扩散孔;第五次光刻—引线接触孔;第六次光刻—金属化内连线：反刻铝;CMOS工艺集成电路;CMOS集成电路工艺--以P阱硅栅CMOS为例;CMOS集成电路工艺--以P阱硅栅CMOS为例;CMOS集成电路工艺--以P阱硅栅CMOS为例;CMOS集成电路工艺--以P阱硅栅CMOS为例;CMOS集成电路工艺--以P阱硅栅CMOS为例;CMOS集成电路工艺--以P阱硅栅CMOS为例;CMOS集成电路工艺--以P阱硅栅CMOS为例;CMOS集成电路工艺--以P阱硅栅CMOS为例;CMOS集成电路工艺--以P阱硅栅CMOS为例;CMOS集成电路工艺--以P阱硅栅CMOS为例;CMOS集成电路工艺--以P阱硅栅CMOS为例;CMOS集成电路工艺--以P阱硅栅CMOS为例;CMOS集成电路工艺--以P阱硅栅CMOS为例;集成电路中电阻1;集成电路中电阻2;集成电路中电阻3;集成电路中电阻4;集成电路中电阻5;集成电路中电容1;集成电路中电容2;微电子制造工艺;IC常用术语;IC工艺常用术语;生产工厂简介;Fab Two was completed January 2, 1996 and is a State of the Art facility. This 2,200 square foot facility was constructed using all the latest materials and technologies. In this set of cleanrooms we change the air 390 times per hour, if you do the math with ULPA filtration this is a Class One facility. We have had it tested and it does meet Class One parameters (without any people working in it). Since we are not making microprocessors here and we dont want to wear space suits, we run it as a class 10 fab. Even though it consistently runs well below Class Ten. ;Here in the Fab Two Photolithography area we see one of our 200mm .35 micron I-Line Steppers. this stepper can image and align both 6 8 inch wafers. ;Another view of one of the Fab Two Photolithography areas. ;Here we see a technician loading 300mm wafers into the SemiTool. The wafers are in a 13 wafer Teflon cassette co-designed by Process Specialties and SemiTool in 1995. Again these are the worlds first 300mm wet process cassettes (that can be spin rinse dried). ;As we look in this window we see the Worlds First true 300mm production furnace. Our development and design of this tool began in 1992, it was installed in December of 1995 and became fully operational in January of 1996. ;;Process Specialties has d