基于厚膜技术的不锈钢压力传感器工艺研究及性能优化-机械工程专业论文.docx

华中 华中科技大学硕士学位论文 万方数据 万方数据 Abstract Thick-film pressure sensor (TFPS) has been developed for more than 40 years. During this period, the research on the theory of this technology goes deeper and deeper. Therefore, broader applications have been found in different fields, especially in automotive electronics, one of the most important applications. In early time, thick-film pressure sensor was mainly based on 96% Al2O3 ceramic substrate, which is still widely in use nowadays. One disadvantage of Al2O3 ceramic substrate is its brittleness. .With the development of thick-film ink system, a new type of thick-film pressure sensor, based on steel substrate, has been proposed, which has not been reported due to its proprietary nature. However, efforts have been made in this direction among the domestic research organizations and companies. The relative research, in this paper, is conducted under the support of Fine MEMS Inc. On the basis of overall research on the characteristics of thick-film ink system, fabrication processes and working principle of TFSPS, researches on the processes, optimization and performance of TFPS have been carried out by the combination of finite elements analysis and experiments. The major research is summarized below: On designing of pressure sensor: Fundamental working principle is thoroughly investigated, with consideration of small deflection theory, piezoresistive effect of thick-film resistor (TFR) and Wheatstone bridge; On fabrication of pressure sensor: Fabrication process is designed, advanced screen-printing and thick-film ink system are taken consideration; On the compatibility between thick-film layer and steel substrate: Analysis characteristic of the interface between thick-film dielectric layer and steel substrate; On the layout of thick-film resistors: Model the stress and strain distribution of the steel substrate, accordingly, some samples of TFSPS have been produced; and On the performance of thick-film steel pressure sensor (T