IC芯片封装流程.pptxVIP

Introduction of IC Assembly ProcessIC封装工艺简介;FOL– Back Grinding背面减薄;FOL– Wafer Saw晶圆切割;FOL– Wafer Saw晶圆切割;FOL– 2nd Optical Inspection二光检查;FOL– Die Attach 芯片粘接;FOL– Die Attach 芯片粘接;FOL– Die Attach 芯片粘接;FOL– Epoxy Cure 银浆固化;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– 3rd Optical Inspection三光检查;EOL– End of Line后段工艺;EOL– Molding（注塑）;EOL– Molding（注塑）;EOL– Molding（注塑）;EOL– Laser Mark（激光打字）;EOL– Post Mold Cure（模后固化）;EOL– De-flash（去溢料）;EOL– Plating（电镀）;EOL– Post Annealing Bake（电镀退火）;EOL– TrimForm（切筋成型）;EOL– TrimForm（切筋成型）;EOL– Final Visual Inspection（第四道光检）;IC Process Flow;IC Package （IC的封装形式）;IC Package （IC的封装形??）;IC Package （IC的封装形式）;IC Package （IC的封装形式）;IC Package （IC的封装形式）;IC Package Structure（IC结构图）;Raw Material in Assembly(封装原材料);Raw Material in Assembly(封装原材料);Raw Material in Assembly(封装原材料);Raw Material in Assembly(封装原材料);Raw Material in Assembly(封装原材料);Typical Assembly Process Flow;FOL– Front of Line前段工艺;The End Thank You！