光刻机双驱动微动台温度场分析-机械制造及其自动化专业论文.docxVIP

Ab Abstract - - II - Abstract Wafer stage system is the core of the lithography system，especially the micropositioner is very important for the performance of the whole system. In the working process of lithography，line width and set of carving precision as very important performance parameters，are mainly affected by the performance of micropositioner，and the change of temperature of micropositioner is one of the important factors that affect its performance. The speed of ultra high density IC development is faster and faster，with temperature as its influence factor，the temperature plays a more and more important role，so the temperature precision and stability of the control put forward higher request. So this paper carries out the subject of research on temperature field of lithography dual drive wafer stage，in order to achieve nanoscale localization accuracy with the synchronous motion accuracy and develop high speed and high precision step-scan lithography，which can resolve the difficult problem of ultra precision positioning control and high speed and high precision synchronous scanning technology of 90 nm step-scan lithography. This paper summaries the research status of wafer stage at home and abroad， and introduces the knowledge of heat transfer and finite element method. Through ANSYS finite element software，this paper can carry out temperature field analysis and structural analysis for Epin. Through temperature field analysis，this paper can get temperature distribution and thermal deformation distribution of Epin. Through the static analysis，this paper can get the deformation and stress distribution of Epin under its own gravity，and make sure it has certain stiffness in order to improve positioning accuracy. Through the modal analysis，this paper can get the dynamic characteristics，and find out the weak links and provide guidance for the structure improvement. Through SolidWorks2011 and ANSYS software，this paper can establish the entity mo