光片上网络的可靠性分析-计算机软件与理论专业论文.docxVIP

ABSTRACT As the density of the chip integration increases bigger and bigger, the electrical interconnect, which is the traditional connect method, has met with bottlenecks in terms of bandwidth, time synchronization, reusability, scalability, etc. Because optical interconnect has high bandwidth, low latency, low energy consumption and other advantages, it has become a promising interconnect method. Therefore, Optical Network on Chip (ONoC) tends to be a hot research topic. The microring resonator is a core element in ONoC. Due to the process limitation and thermo-optic effect of the microring resonator, there can be process variation and thermal variation in the work of microring resonators, which induces the reduction of reliability in ONoC. Thus, the study of the reliability is very important for ONoC. This thesis studies the reliability problem of ONoC, with the focus on the influence of thermal effect on the reliability in ONoC. To begin with, the heat spreading model is analyzed based on a certain chip architecture. After that, the temperature profile in ONoC is modeled, involving the analysis of the equivalent thermal resistance circuit, the calculation of thermal resistance, and so on. Then, the temperature drift can be obtained and it can induce the resonant wavelength drift of microring resonators, which results in the band mismatch of the equivalent passband filters along the optical path. Thus, the optical power of signal at the receiver can be reduced and the reliability is cut down. On the basis of research on the temperature profile, the reliability problem caused by the thermal effect is discussed and simulated. The results indicate that the factors, like the chip power consumption, 3-dB passband width of microring resonators, the temperature dependence coefficient, have a bad effect on the reliability. According to the study of the reliability problem caused by thermal effect, the reliability problem in the 6×6 mesh-based ONoC is analyzed in detail.