几种纳米复合薄膜的制备 表征及应用研究-化学、分析化学专业论文.docx

几种纳米复合薄膜的制备 表征及应用研究-化学、分析化学专业论文.docx

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陈扬 陈扬 兰州大学博上学位论文 中文摘要 曼增强效应;经过十二硫醇的化学修饰,树枝纳米Ag/Cu膜表面呈现超疏水特 性及低的接触角滞后性能。 4.采用无电沉积的方法,分别以Ag和Pd催化晶籽层沉积Pd/Ag薄膜。薄 膜的形态和组成分别用原子力显微镜(AFM)和X光电子能谱(xPs)表征。实验 表明Ag晶籽不能催化Pd纳米粒子的沉积,得到的只是纯Ag,而非Pd/Ag合金; Pd晶籽却能催化Ag纳米粒子的沉积,得到的是Pd/Ag合金。同时,Ag纳米粒 子在Pd晶籽上的沉积速率比在Ag晶籽上的快得多。以所制得的薄膜为工作电 极,在暗态条件下测其阴极极化曲线,考察了析氢反应情况。 关键词:纳米复合薄膜;电泳沉积;无电沉积;光催化降解;电子顺磁共振(EPR); 表面增强拉曼;超疏水性能 Ⅱ 陈扬 陈扬 兰州大学博上学位论文 Abstract In this thesis,Ti02/GE,dendritic Ag/Cu and Pd/Ag nano composite thin films ar e prepared by electrochemical or electroless techniques.The morphology and composition of the films are studied comparatively by using XRD,SEM,AFM and XPS.Promising multifunctional applications are obtained including photocatalytic degradation,strong surface-enhanced Raman scattering(SERS)enhancement and superhydrophobic application.The main contents are described as follows: 1.Nano-Ti02 particles were immobilized on graphite electrode(GE)and indium-tin oxide coated glass(ITO)using electrophoretic deposition,respectively. The obtained Ti02/GE and Zi02/ITO film electrodes were characterized by X·ray diffraction(XRD),field emission scanning electron microscopy(FE—SEM)and anodic photocurrent response test.It Was found that Ti02/GE electrode had much higher photocurrent and more effectively reduced the recombination rate of the photo—induced electron-hole pairs,compared with Ti02/ITO electrode.The photocatalytic activity of TiOffGE Was higher than that of Ti02/ITO for the photocatalytic degradation of acid red G. 2.Formaldehyde Was degradated with photo—catalysis by Ti02 nanoparticles and 2-methyl-2一nitro—propane(MNP)Was used as a spin trap(ST).The radical intermediates in the process of reaction were studied and a new spin adducts(ST-R) Was obtained.The results of Electron Paramagnetic resonance(EPR)indicated that intermediates of formaldehyde degradation in aqueous solution were。CH(OH)2.And a new degradation mechanism was proposed. 3.Hierarchical and well—defined Ag dendrites were obtained by the reaction between copper m

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