具有侧面冗余的铜互连线的电迁移效应研究-电子科学与技术专业毕业论文.docxVIP

具有侧面冗余的铜互连线的电迁移效应研究Study 具有侧面冗余的铜互连线的电迁移效应研究 Study on the Electromigration of Copper Interconnects with Side Reservoir Abstract The lifetime ofa chip is determined by its reliability．With the advancement ofprocess，the 1ine width of the interconnect becomes smaller and smaller．While the current density that goes through the interconnect becomes larger and larger，electromigration has become a serious problem．111e traditional method to solve the electromigration issue is increasing the line width， which will take large amount of routing resources．Adding a small reservoir to the via structure Can