激光选择性刻蚀有机复合材料金属薄膜技术的研究-光电信息工程专业论文.docxVIP

激光选择性刻蚀有机复合材料金属薄膜技术的研究-光电信息工程专业论文.docx

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华 华 中 科 技 大 学 硕 士 学 位 论 文 II万方数据 II 万方数据 Abstract Solid surface antenna reflector of spacecraft played an important role in the area of aerospace, information transmission, and even military, however the structural material and surface functional graphic material of antenna reflector had a great difference in the terms of physical and chemical properties. Using laser to process the composite/metal film combinatorial materials with high-precision meant the structural material must undamaged and the functional layer must be processed accurately. How to manufacture large-format metal film graphic structure in three-dimensional complex curved surface with high-quality, high-precision and high-efficiency, had become the core technical problem of modern advanced manufacturing. A 1064 nm fiber laser and a 355 nm all-solid-state ultraviolet laser were used for directly etching the copper layer of glass epoxy copper clad laminate (CCL). The effects of laser conditions and thinness of the copper layer on the processing quality (including depth and roughness) were studied. A new interface separate processing program as well was proposed ——after etching contour on the CCL, laser heated the copper layer by scanning in a proper focus distance, by vaporizing part of the organic substrate the copper layer would separate from the substrate material and ultimately achieved the goal of selective etching the experimental material. Experimental results and mechanism analysis showed that the interface separate processing program had a better morphology and lower residual amount of Cu atoms, however the directly etching processing program was better in the repeatability and consistency, as well as processing efficiency. After the successful and high-quality implementation of processing composite / metal film system in two dimensions, fiber laser directly processing program was selected as the most suitable method of three-dimensional etching processing. Using the 3 +2 three-dimensional p

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