pcb工艺术语文档.docxVIP

* Process Module 说明 : A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料发料 (Panel)(Shear material to Size) B. 钻孔 (Drilling) b-1 内钻 (Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射钻孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔钻孔 (Blind Buried Hole Drilling) C. 乾膜制程 ( Photo Process(D/F)) c-1 前处理 (Pretreatment) c-2 压 膜 (Dry Film Lamination) c-3 曝 光 (Exposure) c-4 显 影 (Developing) c-5 蚀铜 (Etching) c-6 去膜 (Stripping)