hdi印刷线路板流程介绍资料.pptVIP

PCB学习天地收藏 网址: 23.護形層製作 (顯像)(Conformal Mask) 24. 護形層製作 (蝕銅) (Conformal Mask) 25.護形層製作(去膜) (Conformal Mask) 26. 雷射鑽孔 (Laser Ablation)及機械鑽孔 Mechanical Drill (P.T.H.) Laser Microvia (Blind Via) 27. 機械鑽孔 (Mechanical Drill) 28. 電鍍(Desmear Copper Deposition) 29. 外層線路製作 (Pattern imaging) 壓膜(D/F Lamination) 曝光(Exposure) 顯像(D/F Developing) 蝕銅 (Etching) 去膜(D/F Stripping) 30. 防焊(綠漆)製作 (Solder Mask) WWEI 94V-0 R105 31. S/M 顯像 (S/M Developing) 32. 印文字 (Legend Printing) 33. 浸金(噴錫……)製作(Electroless Ni/Au , HAL……) WWEI 94V-0 R105 WWEI 94V-0 R105 Dedicate or universal Tester Flying Probe Tester 34. 成型 (Profile) 35. 測試 (Electrical Testing) WWEI 94V-0 R105 WWEI 94V-0 R105 36. 終檢 (Final Inspection) 37. O.S.P. (entek plus Cu_106A….) →Option LASER BLIND BURIED VIA LAY-UP A = THROUGH VIA HOLE (導通孔) B = BURIED VIA HOLE (埋孔) C = One Level Laser Blind Via (雷射盲孔 ) LASER BLIND BURIED VIA LAY-UP BURIED VIA AND LASER BLIND VIA OPTION (雷射盲埋孔之選擇) D C C D = Two Level Laser Via (雷射盲孔 ) C D C B-STAGE FR-4 Core RCC FR-4 Core B-STAGE RCC A B B A BURIED VIA LAY-UP A = THROUGH VIA HOLE (導通孔) B = BURIED VIA HOLE (埋孔) C = BLIND VIA HOLE (盲孔 ) D = BLIND HOLE MLB VIA (多層盲孔) BLIND VIA LAY-UP BLIND VIA SEQUENTIAL LAY-UP A B B A RESIN B-STAGE BLIND AND BURIED VIA OPTION (盲 埋 孔 之 選 擇 ) D A C C E = VIA IN PAD (VIP) (導通孔在pad裡面) E Conventional PCB FR-4 Build-up Layer Build-up Layer Photo-via Photo-Imageable Dielectric (PID) FR-4 Conventional PTH Conventional PTH Conventional PCB Blind Via PCB PTH 3 mil line SVH IVH Chip-on-SVH FR-4 Conventional PTH Conventional PTH HDI 印 刷 電 路 板 流 程 介 紹 * HDI Manufacturing Process Flow Pre-engineering Pattern imaging Etching Laminating Drilling Cu plating Hole plugging Pattern imaging Lamination Laser Ablation Mechanical drilling Pattern imaging Cu plating Solder Mask Surface Finished Routing Visual inspection Electric test Shipping Pre-engineering Pattern imaging Etching Laminating Drilling Desmear Cu plating Hole plugging Cu plating Belt Sanding Lami