流程图 pcb mfgflow chart资料文档.pptVIP

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流程图 pcb mfgflow chart资料文档.ppt

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流程图 pcb mfgflow chart资料文档

HOLE SIZE AND DENSITY (2) HOLE SIZE PANEL DEPTH 0.014” -0.020” GREATER 3 DEEP 0.012” 2 DEEP 0.010OR LESS 1 DEEP * NUMBERS BASED ON STANDARD 0.062” BOARD THICKNESS. * REDUCING FROM 3 DEEP TO 1 DEEP INCREASE COST BY APPROXIMATELY 15% * REDUCING FORM 3 DEEP TO 2 DEEP INCREASECOST BY APPROXIMATELY 4-5% 0.021” GREATER 4 DEEP PAD SIZE VS. HOLE SIZE THE ANNULARS RING CALLOUT ON THE CHART DOES NOT APPLY TO REQUIREMENT AT THE JUNCTION. ALL VIA PADS SHOULD BE TEAT DROPPED AT THAT POINT - CALLOUT APPLIES TO THE REMAINDER OF THE PAD. *DRILL SIZE = FINISHED SIZE + 4-6 mil Tang. 0.001 .002 .002 0.020 PAD .012DR .010DR .008DR .008DR 0.022 PAD .014DR .012DR .010DR .010DR 0.024 PAD .016DR .014DR .012DR .012DR 0.026 PAD .018DR .016DR .014DR .014DR 0.028 PAD .020DR .018DR .016DR .016DR 0.030 PAD .022DR .020DR .018DR .018DR SOLDER MASK AVAILABLE TYPES: * TAIYO PSR-4000(LPI) * PLATO HAS CAPABILITY TO PLACE SOLDERMASK DAMS ON .016 AND .020” PITCH DEVICE. NOMENCLATURE ※ MOST FAB SPECS CALL FOR NO SILKSCREEN ALLOWED ON SMD PADS. ※ ACHIEVE THIS REQUIREMENT, THE LETTER CHARACTER OR LINE MUSTBE .008 MINIUM FROM SMD PAD. ※ PREFERRED LETTER WIDTH - .008(DO NOT LESS THAN .006) ※ PREFERRED LETTER HEIGHT- .100 ※ ABSOLUTE MINIMUM -0.060 GOLD PLATING THE FOLLOWING DESIGN PARAMETERS AFFECT THE GOLD PLATING PROCESS. 1.PLACING VIA HOLE TOO CLOSE TO THE GOLD FINGER. PLATO PREFERS TO SEE .025” MINIMUM FROM EDGE OF VIA PAD TO EDGE OF TAB FINGER. THIS ALLOWS ROOM FOR TAPING OFF THE REMAINDER OF THE BOARD PRIOR TO GOLD. IT ALSO ELIMINATES THE VIA HOLES WHICH MAY RESULT IN A DARK HOLE CONDITION. 2. GOLD THICKNESS : 30 μ(MAX.) NICKLE THICKNESS : 100μ(MIN.) T.C.P.(TAPE CARRIER PACKAGE) T.A.B.(TAPE AUTOMATED BONDING) TCP IS AN