04483595—接收发射天线的去耦.pdfVIP

1180 IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, VOL. 56, NO. 4, APRIL 2008 TABLE I PERFORMANCE SUMMARY OF THE CHIP ANTENNA AND COMPARISON WITH REPORTED STATE-OF-ART DESIGNS Dimension in millimeters (mm), bandwith in gigahertz (GHz), gain in dBi, and its flatness in decibels (dB). FN (Feeding Network) Table I shows a summary of measured performances of our chip [10] Y. P. Zhang, “Integration of microstrip antenna on cavity-down ce- antenna. The comparison with other reported state-of-the-art chip an- ramic ball grid array package,” Electron. Lett., vol. 38, no. 22, pp. tennas is also presented. Here it should be mentioned that other de- 1307–1308, Sep. 2002. [11] S. B. Cohn, “Slot line on a dielectric substrate,” IEEE Trans. Microw. signs using different voltage standing wave ratio (VSWR) values to Theory Tech., vol. 17, no. 10, pp. 768–778, Oct. 1969. define their impedance bandwidths. VSWR 2:3, 2.5, 2.4, and 2.5 [12] M. J. Ammann, “Control of the impedance bandwidth of wideband are used respectively, in [2]–[5]. It is shown that our chip antenna has planar monopole antennas using a beveling technique,” Microw. Opt. good performance and can be produced in large quantity using a sim- Technol. Lett., vol. 30, no. 4, pp. 229–232, August 2001. [13] [Online]. Available: pler single-layer LTCC technology. As the radiating element and the ground is printed on the surface of the ceramic subst