倒装焊工艺(bumping).pdfVIP

BUMPING INTRODUCTIONBUMPING INTRODUCTION BUMPING INTRODUCTIONBUMPING INTRODUCTION BUMPING INTRODUCTIONBUMPING INTRODUCTION BUMPING INTRODUCTIONBUMPING INTRODUCTION Bumping process introductionBumping process introduction Bumping process introductionBumping process introduction Domestic Bumping industryDomestic Bumping industry Domestic Bumping industryDomestic Bumping industry Reflow machineReflow machine Reflow machineReflow machine Bumping process introduction Wafer bumping: planting ball on wafer pad Application: advanced package (BGA WLPCSP…..) Wafer bumps - gold bums - solder bumps - plating bumps - stencil printing bumps - solder ball attach Bumping process introduction Methods of wafer bumping for flip chip Gold bumping (plated) Solder bumping (plated) Gold ball (stud) bumps (gold wire micro weld) Solder ball bumps placement Stencil Printed solder bumping Bumping process introduction Solder bumping process is accomplished in a foundry-like processing setting. The bumps are generally made of lead, tin, or a combination of both. Solder Bumping process flow Bumping process introduction • gold ball bumping is truly an extension of the wire bonding process. Wire bonding. Gold (stud) bumps Bumping process introduction Stencil printed solder bumping Bumping process introduction Solder ball bumps placement and reflow Bumping process introduction Costs of gold ball bumping vs. platingCosts of gold ball bumping vs. plating Costs of gold ball bumping vs. platingCosts of gold ball bumping vs. plating Domestic Bumping industry 苏州颀中 Chipmore 上海宏茂 Chipmos 上海安靠 Amkor