集成电路可测性设计之概述.pptVIP

Fundamentals on Testing and Design for Testability Design Verification, Testing and Diagnosis Design Verification: Ascertain the design perform its specified behavior Testing: Exercise the system and analyze the response to ascertain whether it behaves correctly Diagnosis: To locate the cause of misbehavior after the incorrect behavior is detected Some Real Defects in Chips Processing Faults missing contact windows parasitic transistors oxide breakdown Material Defects bulk defects (cracks, crystal imperfections) surface impurities (ion migration) Time-Dependent Failures dielectric breakdown electromigration Packaging Failures contact degradation seal leaks Faults, Errors and Failures Fault: A physical defect within a circuit or a system May or may not cause a system failure Error: Manifestation of a fault that results in incorrect circuit (system) outputs or states Caused by faults Failure: Deviation of a circuit or system from its specified behavior Fails to do what it should do Caused by an error Fault --- Error --- Failure Scenario for Manufacture Test Purpose of Manufacture Testing Verify Manufacture of Circuit Improve System Reliability Diminish System Cost Cost of repair goes up by an order of magnitude each step away from fab line ASIC What is ASIC: Application Specific Integrated Circuits Why we need ASICs Microelectronic economics Volume Time to market Quality Why Testing is Difficult ? Test application time can be exploded for exhaustive testing of VLSI For a combinational circuit with 50 inputs, we need 250 = 1.126x1015 test patterns. Assume one test per 10-7sec, it takes 1.125x108sec = 3.57yrs. to test such a circuit. Test generation of sequential circuits are even more difficult. Lack of Controllability and Observability ofFlip-Flops (Latches) Functional testing may not be able to detect the physical faults How To Do Test Fault Modeling Identify target faults Limit the scope of test generation Make analysis possible Test Generation Au