CuInvar合金复合材料的设计是 制备与性能研究.docx

优秀毕业论文 精品参考文献资料 AbstractAbstract Abstract Abstract The demands on the performance of electronic packaging materials have became higher and higher due to the progress of science and technology,the development of manufacturing standard，the rapid rise of integration level and heat generation rate of per unit area of the circuit board．Pure copper has excellent electrical and thermal conductivity,however its thermal expansion coefficient is very high．Invar alloys have a very low coefficient ofthermal expansion coefficient，but its thermal conductivity is very low．Therefore，researchers deske to desi