光刻胶参数大全.docx

Summary of Photoresists 4000 rpmType application / condition Do [μm] 4000 rpm  product spray resists for complex topologies [ 6 ] AR-P 1250 spray resist for different applications [ 0,5-10 ] AR-P 1210, 1220, 1230 new Positive resistsproduction of masks, optical applications 1,0 ; 0,6 AR-P 3110, 3120 Positive resists thick resists with high struct. accuracy up to 40 μm 10 ; 5 AR-P 3210, 3250 thick resist with high transparency up to 100 μm 10 AR-P 3220 wide process range for patterns 2 μm 2,0 ; 1,4 AR-P 3510 (T), 3540 (T) high resolution for sub-structures 1,4 ; 1,4 AR-P 3740, 3840 protective coat., KOH-resistent, adhesion enlarged 1,1 ; 2,2 AR-PC 503, 504 lift-off-structures 5 ; 1,0 AR-P 5320, 5350 two-layers-lift-off-system with AR-P 3510 1,0 ; 0,5 AR-P 5460, 5480 Image reversal optional positive or negative  1,8 ; 1,4 ; 0,6 AR-U 4030, 4040, 4060 New developments Negative resistsspray coating, for different applications [ 0,5-10 ] AR-N 2210, 2220, 2230 New developments Negative resists ??positive resists AR-P 1210-1230 stable sub-μm structures, mid and deep UV 1,4 AR-N 4240 high response to i-line (g-line, deep UV) 1,4 AR-N 4340 CAR 44: layers up to 100 μm, aqueous alkaline development, easy to remove  1000 rpm: 10 ; 25 ; 50  AR-N 4400-10, -25, -50 additional for lift-off-structures 10 AR-N 4450-10 experimental samples, ready for production resists for spray coating thick resist with high vicosity and thermal stability resist for deep UV, etch resistant alkaline stable, able for structuring 4000 rpm:60,61,4new developments:X AR-P 1270X AR-P 4000 rpm: 6 0,6 1,4 new developments: X AR-P 1270 X AR-P 3220/7 X AR-P 5800/7 X AR-P 5900/4 Process chemicals developer: buffered systems, concentrat AR 300-26, 300-35 developer: metal ion free, different concentrations AR 300-44 … -475 Remover: organic solvents AR 600-70, 300-70, -72 Remover: aqueous-alkaline AR 300-73 adhesion promoter AR 300-80, HMDS ? price lists: photoresists, experimental samples, AVB  as of Januar