覆晶技术-公开课件（讲义）.pptVIP

覆晶技術 徐昌煜 Charles Hsu 壓力驅動式覆晶底層充填封裝Pressurized Underfill Encapsulation of Flip-Chip 充填時間可大大縮短。具有縮短充填時間1000倍或更多的潛力。 Filling time can be reduced dramatically. It has the potential of shortening the fill time by a factor of 1000 or more. 壓力驅動式覆晶底層充填封裝對點膠式覆晶底層充填封裝的優勢 Advantages of Pressurized Underfill Encapsulation of Flip-Chip over Dispensing one 快速硬化型封裝材料因充填時間短而得以使用，所以硬化時間縮短。 Curing time can be reduced, since a short filling time enables us to use a fast curing encapsulant. 壓力驅動式覆晶底層充填封裝對點膠式覆晶底層充填封裝的優勢 Advantages of Pressurized Underfill Encapsulation of Flip-Chip over Dispen