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Section 9.3  Basic Au Wire Bond Process Contents Basic Introduction Gold Wire Bonder Bonding Sequence Material Tools Bond Quality Basic Introduction Understand an IC Package IC Manufacturing Flow Wire Bonding Introduction Cross-section of an IC Package IC Manufacturing Flow Wafer Grinding Gold Wire Bonding Wedge Bonding What technique is used in Gold Wire Bonding? Wire Bonding Techniques There are three basic wire bonding techniques: Thermosonic bonding: utilizes temperature, ultrasonic and low impact force, and ball/ wedge methods. Ultrasonic bonding: utilizes ultrasonic and low impact force, and the wedge method only. Thermocompression bonding: utilizes temperature and high impact force, and the wedge method only. Thermocompression vs Thermosonic Thermocompression welding usually requires interfacial temperature of the order of 300°C. This temperature can damage some die attach plastics, packaging materials, and laminates, as well as some sensitive chips. Thermosonic welding, the interface temperature can be much lower, typically between 100 to 150°C, which avoids such problems. The ultrasonic energy helps disperse contaminates during the early part of the bonding cycle and helps complete the weld in combination with the thermal energy. Advantages of Thermosonic Metallurgical joining is more reliable than conductive particles and adhesive joining. Process cycle time can be reduced from several minutes to less than 10 seconds. Lower manufacturing cost per unit. Comparison of Different Wire Bonding Techniques What are the important parameters in Gold Wire Bonding? Bonding Parameters Thermosonic Bonding Pressure (Force) Amplify Frequency (Power – 138KHz) Welding Time (Bond Time) Welding Temperature (Heater) Bonding Principle Next to Gold Wire Bonder Gold Wire Bonder Machine Roadmap Understand Individual Part Machine Specification Bonding Temperature ASM Gold Wire Bonder Roadmap Machine Model (ATS) AB308?AB309?AB309A?AB339 ?AB339Eagle?Eagle60 ?Eagle