晶体硅的相关论文.docVIP

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  • 2019-11-07 发布于江苏
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PAGE PAGE 15 Research on The Explosive Impact Vibration Damage Model of Electronic Equipment Based on ANSYS/LS-DYNA SHI Quan,TIAN Qing-wei,WANG Guang-yan,HU Qi-wei (Department of Management Engineering,Shijiazhuang Mechanical Engineering College, Shijiazhuang Hebei 050005,China) Abstract: The thesis designed a basic simulation project on the explosive vibration damage of electronic equipment.Found a two dimensional model including the explosive,the ground,the elastic body and the electronic equipment with ANSYS/LS-DYNA.Acquired a lot of data corresponding to the explosive impact vibration c

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