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Student course work 2.
Student Name: Zhang Miao Student ID: 4114731
E-mail: Date: 09.01.2011
Introduction Problem description
Introduction of heat pipe technology
A heat pipe is a simple device that can quickly transfer heat from one point to another. It consists of a sealed aluminum or copper container whose inner surfaces have a capillary wicking material (a wick material is to aid the flow of the liquid [1]). It differs from a thermosyphon by virtue of its ability to transport heat against gravity by an evaporation-condensation cycle with the help of porous capillaries that form the wick.[2]
Fig.1 Working principle of heat pipe [3]
Problem description
This design report aims to solve a task concerning a heat transfer solution, which is based on designing cooling system by using a heat pipe system to dissipate the heat from a hot component on the PCB (see the red-colored component of 50 W in Figure 1 shown below), and to make sure the temperature of this component will not exceed 85°C.
Fig2. Component of the PCB
Thermal specifications of the component are shown below:
Ambient temperature: 35°C
Power load of the component: 50 W
Component dimension: 40mm x 40mm x 2mm
Space restriction of the cooling system: 320mm (L) x 95mm (W) x 25mm (H)
The purpose of the design focus on the following issues:
Choose the suitable working fluid for the heat pipes and give explanations.
Determine the diameter, condensation section and evaporation section of the heat
pipe(s).
Complete the heat pipe(s) calculation and determine the numbers of heat pipe(s).
Cooling system design
Calculate the heat transfer area of fin stack
Method
Container
The function of the container is to isolate the working fluid from the outside environment. It has to therefore be leak-proof, maintain the pressure differential across its walls, and enable transfer of heat to take place from and into the working fluid. [4]
The heat pipe in this design will be made by copper (the the
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