plasma原理教学提纲.pptVIP

Delamination is the biggest challenge for organic based substrate because of outgassing and moisture release during the process. Oxidation on metal leadframes can inhibit the adhesion of frame to mold. The plasma process can remove the contaminants and oxide from the surface and activate the surface, thus, minimize the interface delamination. Void Free Underfill - Unique challenge in Flip Chip packaging is the underfill process, particularly designs that utilize large dies, tight gaps, and high density ball placement. Flip Chip Underfill – In this packaging process it is extremely important for the epoxy underfill to wick under the chip without voiding in a timely manner. Plasma treatment increases surface energy promoting adhesion, minimizing voiding, and increasing wicking speeds. Proper application of plasma cleaning, after die attach and prior to the application of the underfill epoxy will compel the epoxy to wick quickly under the chip and greatly improve the homogeneity of the under-fill material. Two key benefits of plasma treatment: decreased voiding and increased dispensing speeds. Oxidation - Presence of oxides inhibits wire bonding and solder reflow. Eutectic solder is used as an adhesive material for die bonding – oxidation can limit good die attachment. Plasma treatment reduces metal oxides and improves wire bonding and solder reflow. Eutectic solder is used as an adhesive material for die bonding – oxidation can limit good die attachment. –Reduce Metal Oxides to improve soldering Desmearing in Printed Circuit boards – when vias are mechanically or laser drilled in printed circuit boards (PCB) some of the laminate material (usually epoxy resin) is smeared over the exposed edges of the inner metal conductor lines. Subsequent plating of the vias must electrically connect all the conductor lines intersected by the via on the different layers. The smeared resin must be removed to ensure good electrical contact. Desmearing normally uses oxygen