Bumping-process-flow-FOC制程培训资料.pptVIP

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  • 约4千字
  • 约 12页
  • 2020-06-01 发布于浙江
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SPIL Confidential - SPIL Bumping Technology SPIL Confidential - SPIL Bumping Technology SPIL Confidential - SPIL Bumping Technology SPIL Confidential - SPIL Bumping Technology Bumping process flow-FOC Printing UBM PSV I C Al/Cu Pad Solder Paste UBM sputtering UBM Etching/PR strip DF Coating/Exposure; Solder printing/DF strip Solder Reflow PR Developing PR Coating /Exposure PR DF DF REPSV Printing Bump Process Flow DF DF UBM sputtering UBM Etching PR Coating/Exposure /Developing Plating Process – FOC Flow 2.UBM SPUTTER 3. PHOTO PROCESS 5.PR STRIP 4. PLAT Reflow 7. Reflow

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