北京大学微电子学的研究院,方东明组会.pptVIP

Group Meeting ng Fang April 18, 2008 6未来散电子学研究院微米纳米加工技术国水经重点实宣 Work in the last two weeks Rea 3 Read (4 e Conceiving 6未来散电子学研究院微米纳米加工技术国水经重点实宣 Work in the last two weeks g Completed pPt file for oral speech In English Proper About 35 Contents Pages 6未来散电子学研究院微米纳米加工技术国水经重点实宣 Work in the last two weeks Thesis draft written by Desig Fabrication Measured 6未来散电子学研究院微米纳米加工技术国水经重点实宣 Work in the last two weeks Processes information storage PECVD: SiO, SiN SiC ICP: Si. TI/AL Cr/Cu. Cr/P1 Sputter: Ti, Au, Pt, Al Ti/Pt/Au. Pyrex. Sio RIE: Si, SiO,, Si3Na, SiO, LPCVD: PolySi, SiO2, Siana Solutions:K○