先进芯片封装知识介绍演示.pptVIP

Advanced Packaging Tech Outline Package Development Trend 3D Package WLCSP Flip Chip Package 2 Package Development Trend Moores law 90nm65nm45/40nm32/28nm eration LF TAl FC a 3D SiP E Innovation Pkg FCBGA 28nm Plating PHGA rfor nce aFN a-fc csP Hybrid SiP Package System Integration PiP E PoP)际 TRD Po aMAP POP miniaturization Density SBS aWLp 3D aWLP WLCSP/aCSP Std COLOFN aWLP 1990 2008 2010 2012 Package Development Trend V SO Family V QFP Family V BGA Family EDHS-QF FCBGA OL-TSOP (4 dies) COL- TSOP(B dies DHS- LOFP E- PAD LQFP EHS_FCBGA MP- FCBGA Terminator FCBGA EBGA COL- VSoP(2 dies) DDV SOP -PAD TGFP ♀曼9E Package Development Trend V CSP Family Memory Card SiP Module 四网 FCOFN NBA MIcro SD 吗 WiFi+BI+FM Radio Module S-TFBGA V/U/WIXFBGA COSBGA Wimax Module MS Duo WB.S.FCC SP