信号完整性剖析过孔连接器封装汇编.pptVIP

信号完整性分析 Signal Integrity 第五讲:过孔、连接器、封装  Vias, Connectors, and packages 第五讲:过孔、连接器、封装 Suggested Reading [1] SHall, G Hall, and J McCall, High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practice, Chapters 5 lI John wiley Sons, 2000 [2 H Johnson and M Graham, High-Speed Digital Design: A handbook of Black Magic, Chapters 7 9, Prentice Hall, 1993. 3] B Young, Digital Signal Integrity, Chapter 2, Prentice Hall, 2001  How are signal getting from one chip to another? Vias connectors and packages are all important and parts of the path Pentium 4 D CPU goes here 时 Bridge B ridge chip Memory chip pacKage C onnecTo  opI Vias Definition: what are they and why do we need them? s Electrical models of via parasitics Connectors Definition: what are they and why do we need them? Electrical effects Inductance SLEM-style approximation Power and ground pins Design considerations(tradeoffs, rules of thumb)  Topics(continued) Packages Definition: what they are and why we need them? Common types(e. g. flip-chip, bondwire)and history Creating package models Effect of a package on signal integrity Design considerations  Vias o Vertical connections between layers made by drilling a small hole and filling it with conductive material Connecting metal layers on silicon chips, within packages and on printed circuit board vias Printed Circuit Board  Via: Vertical Connection between Layers a Barrel: conductive cylinder filling the drilled hole Pad: connects the barrel to the component/plane/trace Antipad: clearance hole between via and no-connect metal layer Trace connected to pad on layer 1 Pad Via pad does not contact plane void is the anti-pad  What can aⅤiaDo? I Connect metal planes of the same potential(e. g, all ground planes conductively attached) a Carry a signal from a trace on one layer to another(e. g every data signal must get from the silicon bump down to the motherboard) a Connect com