IPC-7525A -标准资料文件.pdf

IPC-7525A Stencil Design Guidelines Working Draft 1 February 2004 ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES 2215 Sanders Road, Northbrook, IL 60062-6135 Tel. 847.509.9700 Fax 847.509.9798 IPC-7525A st 1 Working Draft February 2004 1 PURPOSE This document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. 1.1 Terms and Definitions All terms and definitions used throughout this handbook are in compliance with IPCT- 50. Definitions denoted with an asterisk (*) below are reprints from IPC-T-50. Other specific terms and definitions, essential for the discussion of the subject, are provided below. 1.1.1 Aperture An opening in the stencil foil. 1.1.2 Aspect Ratio and Area Ratio Aspect Ratio = Width of Aperture / Thickness of Stencil Foil Area Ratio = Area of Aperture Opening /Area of Aperture Walls 1.1.3 Border Peripheral tensioned mesh, either polyester or stainless steel, which keeps the stencil foil flat and taut. The border connects the foil to the frame. 1.1.4 Contained Paste Transfer Head A stencil printer head that holds, in a single replaceable component, the squeegee blades and a pressurized chamber filled with solder paste. 1.1.5 Etch Factor Etch Factor = Etched Depth / Lateral Etch in a chemical etching process 1.1.6 Fiducials Reference marks on the stencil foil (and other board layers) for aligning the board and th