SMT板组装工艺建议.docx

SMT板组装工艺建议 SMT Board Assembly Process Recommendations Application Note This application note describes the board assembly process used in surface-mount technology (SMT) and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual components on already-assembled boards. The information in this application note is for your reference only. Conventional Tin-Lead and RoHS-Compliant Lead-Free Components provides both the conventional tin-lead and restriction of hazardous substances (RoHS)-compliant lead-free packages. Table 1 lists the second Level Connections of each package type. Table 1. Second Level Connections Package Type Wire Bond (Eutectic) Wire Bond (RoHS Compliant or Pb-Free) Flip Chip Flip Chip (RoHS Compliant or Pb?Free) Lead frame Sn85Pb15 Matte Sn — — Ball-grid array (BGA) Sn63Pb37 (Balls) SAC305 (Balls) Sn63Pb37 (Balls) SAC305 (Balls) While lead-frame and wire-bond packages can be provided as eutectic or lead-free, currently Altera flip-chip packages are RoHS compliant. We use Exemption #15 for the first Level Connections between the flip-chip die to the substrate (RoHS Exemption #15: Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within the integrated circuit flip-chip packages). For the remainder of this application note, the term Pb-free is used to refer to the BGA solutions provided with Pb-free package solder balls. This is considered the second Level Connections between the package and the PCBs. The recent directives and legislations by nations around the world have mandated elimination of hazardous substances in the electronics industry. While elimination of many of these substances do not have significant impact on reflow soldering of the electronic component, there is one notable exception—lead. The elimination of lead from solders requires special consideration in soldering of the Pb-free components on to PCBs. This appl