芯片封装-精品课件 .pptxVIP

湖南工业大学计算机与通信学院前沿讲座Lecture 1 集成电路封装技术-多芯片封装陈卫兵Spring 2012Outline芯片封装发展史芯片封装LED封装前沿讲座Slide 芯片封装发展史The transistor invented at Bell lab. in 1947前沿讲座Slide 芯片封装发展史September 12th 1958, Jack Kilby at Texas instrument had built a simple oscillator IC with five integrated components (resistors, capacitors, distributed capacitors and transistors)前沿讲座Slide 芯片封装发展史1959 - Planar technology invented 前沿讲座Slide 芯片封装发展史1960 - Epitaxial deposition developed Bell Labs developed the technique of Epitaxial Deposition1960 - First MOSFET fabricated Kahng at Bell Labs fabricates the first MOSFET. 1961 - First commercial ICs Fairchild and Texas Instruments both introduce commercial ICs.1962 - Transistor-Transistor Logic invented 1962 - Semiconductor industry surpasses $1-billion in sales 1963 - First MOS IC,CMOS process inventedRCA produces the first PMOS IC.前沿讲座Slide 芯片封装发展史前沿讲座Slide 9、我们的市场行为主要的导向因素，第一个是市场需求的导向，第二个是技术进步的导向，第三大导向是竞争对手的行为导向。10、市场销售中最重要的字就是“问”。11、现今，每个人都在谈论着创意，坦白讲，我害怕我们会假创意之名犯下一切过失。12、在购买时，你可以用任何语言；但在销售时，你必须使用购买者的语言。13、He who seize the right moment, is the right man.谁把握机遇，谁就心想事成。14、市场营销观念：目标市场，顾客需求，协调市场营销，通过满足消费者需求来创造利润。15、我就像一个厨师，喜欢品尝食物。如果不好吃，我就不要它。16、我总是站在顾客的角度看待即将推出的产品或服务，因为我就是顾客。17、利人为利已的根基，市场营销上老是为自己着想，而不顾及到他人，他人也不会顾及你。前沿讲座Slide 芯片封装发展史国内封装厂：江苏长电、天水华天、日月光、矽品、华泰等合资封装厂：日立、三星、南通富士通等国外封装厂：Intel、AMD等针脚式SMT新一代前沿讲座Slide 芯片封装芯片封装从芯片电学连接电源和信号到板上要求有小的信号延迟和失真机械连接芯片到板上将芯片产生的热量耗散出去保护芯片不被机械、应力毁坏芯片和板的热膨胀系数兼容，防止芯片被热应力损坏制造和测试费用便宜前沿讲座Slide 芯片封装（邦定）Traditionally, chip is surrounded by pad frameMetal pads on 100 – 200 mm pitchGold bond wires attach pads to packageLead frame distributes signals in packageMetal heat spreader helps with cooling前沿讲座Slide 芯片封装（邦定）Two methods前沿讲座Slide 芯片封装（结构形式）过孔和表面贴装形式前沿讲座Slide 芯片封装（高级模式）Bond wires contribute parasitic inductanceFancy packages have many signal, power layersLike tiny printed circuit boardsFlip-chip places connections across surface of die rather than around peripheryTop level metal pads covered with solder ballsChip flips upside downCarefully al