PCB专业英语培训教材.pptx

PCB 坏点英语培训教材;目 录;一、Process Flow;;二、Defect Introduction;1.Board Cut (界 料) ;;GAME1----播音员;Ink residue Spacing under size Insufficient line width Nick circuit;Poor exposure Poor circuit Scratch circuit Under etching Over etching;3.Pressing(压板);4.Drilling（钻孔）;Hole contamination Board dirty Rough hole Block hole;GAME２----单词认读;5.Plated-through hole(沉铜);6.Outer Layer（外层）;Spacing under size Nick CCT(concave) Poor CCT Scratch CCT Under etching Over etching;7.Wet Film（湿菲林）;S\M shift S\M bleeding S\M in hole S\M skipping S\M bubble ;S\M bridge broken Poor S\M Poor carbon ink Excess S\M point rework;GAME 3----抢答;8. Legend Printing（白字）;Missing C\M Poor C\M C\M on wrong side C\M peel off;9. Surface Treatment(表面处理);;Scl hole rough Poor solder stripping Poor solder surface S\M on pad SMD Pitch width under size Grey solder surface ;GAME 4----互相介绍; What are defects? ;Copper expose on root of G\F S\M peel off on root of G\F G\F bevel edge deviation Insufficient gold thickness;W\F on G\F Dent on G\F G\F out of size Gold surface oxidation Gold bleeding Nickle burnt ;;;V-CUT shift V-CUT under spec. V-CUT over spec. ;;The end,thank you!