SMT常见焊接不良.ppt

1:錫珠(Solder ball) 2:錫渣(Solder splashes) 3:側立(Mounting On Side) 4:少錫(Insufficient solder) 5:立碑(Tombstone) 6:虛焊(Unsoldered) 7:偏位(Off Pad) 8:焊盤翹起(Lifted land) 9:少件(Missing Part) 10:冷焊(Cold solder) 11:反白(Upside down) 12:半濕潤(Dewetting) ;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良;SMT常見焊接不良; 1:焊盤氧化(Pad discoloration) 2:漏銅(Exposed Copper) 3:VIA孔不良(Via defect) 4:線路短路(Trace short) 5:分層(Dlamination) 6:板翹(Twist board) 7:Pad沾綠油(Soldermask on Pad) 8:絲印不良(Defect Silkscreen) ;PCB常見不良;PCB常見不良;PCB常見不良;PCB常見不良;PCB常見不良;PCB常見不良;PCB常見不良;PCB常見不良;PCB常見不良;PCB常見不良;PCB常見不良