FCBGA封装器件的失效分析与对策[归纳].pdfVIP

[转帖 ]FCBGA 封装器件的失效分析与对策 Post By ：2009-11-3 10:35:00 以下内容只有 回复 后才可以浏览 FCBGA封装器件的失效分析与对策 摘要： FCBGA(Flip-chip ball grid array) 封装形式器件是近年来集成电路封装的最佳选 择，其可靠性日益引起重视。 本文简要介绍了 FCBGA封装形式器件的结构特点以及相关的可靠性 问题，通过两个 FCBGA封装器件失效的案例， 分析了两只 FCBGA失效器件失效的原因， 一个是芯 片上的焊球间存在铅锡焊料而导致焊球短路， 另一个则是因封装内填料膨胀分层而导致的焊球开 路。提出了针对这种形式封装的器件在使用过程中的注意事项及预防措施， 以减少该类失效情况 的发生。 关键词： FCBGA，失效机理，失效分析 Failure Analysis and Precaution of FCBGA Packaged Devices 1,2 1 1 1 2 Lin Xiao-ling ,Kong Xue-dong ,En Yun-fei ,Zhang Xiao-wen ,Yao Ruo-he China Electronic Product Reliability and Environmental Testing Research Institu te,Guangzhou,510610 South China University of Technology Physics science and technology Guangzhou, 510640 Abstract ：Nowadays, FCBGA (Flip-chip ball grid array )is the optimal choice for IC ’s package. Focus should be put on its reliability. This paper introduced the st ructure characteristic of FCBGA packaged devices and some correlative reliability p roblems of them. By two failure analysis cases of FCBGA devices, the author found t he failure mechanisms of the two failed devices. They are short of the solder balls and open of the solder bumps on the FC die, respectively. The cause for short is t he solder melted and made the nearby solder balls linked. The cause for open is the epoxy underfill between the solder bumps expanded and made the solder bumps ruptur ed , In the end, some precautions for reducing such failures are presented. Key Words: FCBGA, failure mechanism, failure analysis 1 引言 随着硅单芯片集成度不断提高，对集成电路封装要求更加严格， I/O 引脚数急剧增加，功耗 也随之增大。为满足发展的需要，减少器件的寄生电