封装模块等ic制造作业流程.pptxVIP

產品及作業流程介紹;1.1 IC的應用領域;;B1 : 5-1 Nan 2nd Road, T.E.P.Z. 42701 Taichung,Taiwan B2 : 36-1 Nan 2nd Road, T.E.P.Z. 42701 Taichung, Taiwan B3 : 5,Chien-Kuo Road, T.E.P.Z. 42701 Taichung, Taiwan B4 : 6,Nan 2nd Road, T.E.P.Z. 42701 Taichung, Taiwan B5 : 22-1,Nan 2nd Road, T.E.P.Z. 42701 Taichung, Taiwan B6 : 3F, 24,Chien-Kuo Road, T.E.P.Z. 42701 Taichung, Taiwan B1 : TO-92, SOT-23, SOT-25, SOT-26, SOT-89, PD-IC, IC TEST B2 : IC Assembly, PDIP, PLCC, QFP, SOJ, SOP, SSOP, TSOP,TSSOP,TFBGA,CSP B3 : Materials Storage B4 : Solder Plating B5 : IC Assembly, PDIP, PLCC, QFP, SOJ, SOP,