文稿教程案例lordds trainingmicro.ppt

LORD EBC Application Training July 2009 Cecilia Kuo EBC Product Lines Micro Business Thick Film Potting 2 3 Focus is on microelectronics packaging… 4 …limited to IC packaging… …into surface mount devices 5 Typical package assembly process 6 Our products are used in the back-end of electronic packaging. Thermal Interface Materials from LORD Advantage Grease Good dispensing characteristics Low thermal resistance No curing required Removable Repairable Gelease (Gel) Improved adhesion No pump-out Easily Dispensed Soft material allows rework Low Modulus Adhesives More compliant for stress relief Softer materials can be reworked Easily dispensed High Modulus Adhesives High adhesive strength Superior thermal performance Disadvantage Prone to pump-out Resin bleed over time Minimal adhesion Cure required relative to a grease Low to moderate adhesive strength Not easily reworkable Low thermal mechanical stress relief Frozen Product Shipping and Transportation MG121 are shipped in Johnny blue ice during shipping. (-30C) MD-140 are shipped by dry Ice (-40C) . During shipping, materials are packed inside an insulated box which can keep frozen at low temperature up to 6 days. A temperature recorder/indicator may be placed inside the box Each syringes are held vertical down . 8 9 Crystallization – Non-appropriate storage Non-appropriate handling Syringe Type Thawing time 10 c.c. ~90 mins 30 c.c. ~120 mins 2.5 oz ~2- 4 hrs 10 10 Standard DLA Thermal gel Lid attach Adhesive Thermal Adhesive TIM1 Gelease Mg-121 MT-322 - In Flip-Chip package 11 Direct Lid Attach in Flip-Chip Package Pull strength failure sample Cohesive failure was found – residue remained in lids and substrate 12 Lid attach adhesives: ME430 MT-125 Optimized modulus to control package coplanarity and withstand assembly processes and MRT Too high modulus may lead to trace cracking Too low modulus may result in insufficient co-planarity due to insufficient stiffening of substrate High ad