嵌入式微通道散热器实验与数值研究.pdfVIP

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嵌入式微通道散热器实验与数值研究

摘

要：

针对高热流密度固体激光器的散热问题，借助微机电系统（MEMS）技术，利用微通道/热源协同设

计方法，换热器采用连续S型微通道，并利用歧管形成分层分段流动，研制出了一套微型紧凑的嵌入式歧管S型

微通道散热器，并开展了实验研究。使用HFE-7100作为冷却工质，在发热面局部最高温度小于100

℃、平均温

升小于45

℃的情况下，两相时可带走625

W/cm的热通量，相比传统的歧管矩形微通道散热器提高了12%，但流2

阻增大了约56%；利用数值模拟方法，通过改变S型的振幅和波长，根据发热面平均温度、换热面平均努塞尔

数、压降和综合性能因子来评估S型微通道散热器的结构参数对其散热能力和流动阻力的影响，寻找S型微通

道的最优结构设计参数组合。结果表明该散热器的综合性能因子在一个特定的S型形状下存在最佳值。

关键词：

微通道散热；S型微通道；歧管；换热实验；数值模拟

Experimental

and

numerical

study

of

embedded

microchannel

heat

sink

Abstract：

To

solve

the

heat

dissipation

problem

of

high

heat

flux

density

solid-state

laser,

a

set

of

micro-

compact

embedded

manifold

S-shaped

microchannel

heat

sink

was

developed

using

the

MEMS

technology

and

the

microchannel/heat

source

co-design

method.

The

heat

exchanger

uses

continuous

S-shaped

microchannels

and

the

manifold

is

used

to

form

tiered

and

segmented

flow.

Experiment

was

conducted,

using

HFE-7100

as

the

cooling

2

medium.

Results

show

that

the

heat

sink

can

dissipate

625

W/cm,

with

a

local

maximum

temperature

of

less

than

100

℃

and

an

average

temperature

rise

of

less

than

45

℃.

Compared

with

the

traditional

manifold

rectangular

microchannel

heat

sink,

the

heat

dissipation

performance

of

S-shaped

microchannel

increased

by

12%,

but

the

flow

resistance

increased

by

about

56%.

Numerical

simulation

methods

were

used

to

evaluate

the

structural

parameters

of

the

S-shaped

microchannel

heat

sink’s

heat

dissipation

ability

and