可编辑培训课件-机械行业2024年投资策略分析报告：AI拉动算力需求，先进封装，乘势而起.pptx

CONTENTSAI3

摩尔定律实现受阻，先进封装之风兴起4

0118-2416nm10nmIBS1023.5%5nm3nm4%1nm16nm10nm7nm5nm3nm(mm^2)1253.387.664.383.278585()6.910.52.2514.12.1610($)4.983.812.65InternationalBusinessStrategies5

01MoreMooreMoreThanMoore6

012070(DualIn-linePackageDIP)2080QuadFlatPackageQFP)(LeadlessChipCarrierLCC)(SmallOutlinePackage,SOP)(PinGridArray,PGA)20(BallGridArrayBGA)(ChipScalePackageCSP)9021FlipChipWaferLevelPackageWLP)2.5D/3D7

01I/ObumpBumpPitchI/OIDTechExI/O100μm(FlipChip)BumpDensity(TSV)(WLP)/2.5DInterposer3DChiplet2.5D/3DSoIC8

0112342.5D/3DI/ORDLI/O569

01ChipletBumpRDLWaferTSVRDLWaferBumpTSVBumpRDLBump2.5D/3DXYZInterposerRDLTSV2.5D/3DWaferTSV2.5DWLPBumpRDLWaferTSVSiP10

01ChipletBumpRDLWaferTSV1Bump100um5umI/OBumpSKSiP11

01ChipletBumpRDLWaferTSV2RDLRDLI/OI/OI/OI/OI/ORDLI/ORDLSiP12

01ChipletBumpRDLWaferTSV3Wafer6812182.5D13SiP

01ChipletBumpRDLWaferTSV4TSVTSVTSVThrough-SiliconViaZ2.5D3DTSVTSVCMOSHBMMEMSTSV14SK

01ChipletX/YTSVX/YX/YX/YInFOEMIBBumpRDLTSVWaferWLPX/YX/YZTSVFan-inI/OFan-outDieWLPFIWLPICFIWLPFOWLPRDLI/O15SiP

01ChipletX/YInFOIntegratedFan-outInFOTSMC2017InFOFOWLPFOWLPFan-outInFO_PoPInFO_oSInFO_PoPFOWLPPoPDRAMInFO_oSInFORDLInFO_PoPPCB5GFOWLP和InFO对比InFO_PoPInFO_oSIntelSiP16

01ChipletX/YEMIBEmbeddedMulti-DieInterconnectBridgeEMIB2018TSVXYEMIBEMIBEMIBIntelSiP17

01ChipletZTSVZ2.5DTSV3DTSV2.5DTSV3DTSVI/OZTSVTSVInterposer2.5D3D3D3D2.5D2.5D2.5D3D2.5D3DCoWoSFoverosCo-EMIB-SoICX-Cube2.5D3DSiP数据：SiP与先进封装技术公众号18

01ChipletZCoWoSChiponWaferonSubstrateTSV2011CoWoSCoWoS-SCoWoS-RCoWoS-LCoW(ChiponWafer)2.5DSRRDLLLSICoWoS-SCoWTSVRDLCoWoS-LCoWoS-RCoWoS-LRDLCoWoS-RRDLInFOHBMSoCLSICoWoS-SInFOCoWoSCoWoS19

01ChipletZSoICSystemofIntegratedChipsSOIC20193DCoW(ChiponWafer)WoW(WaferonWafer)SoICCoWWoWCoWoSInFOSoIC3DSoCCoWoSInFOSoICCoWoS/InFO20

01ChipletZFoverosCo-EMIoverosFoverosCo-EMIB3DTSVEMIBFoveros2D+3DEMIBFoverosEMIBFoverosFoverosCo-EMIBSiPSiP21

01I-CubeChip