materials for thermal conduction-导热界面材料.docx

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AppliedThermalEngineering212001)1593±1605

/locate/apthermeng

Materialsforthermalconduction

D.D.L.Chung*

CompositeMaterialsResearchLaboratory,StateUniversityofNewYorkatBu?alo,Bu?alo,NY14260-4400,USA

Received15March2000;accepted31January2001

Abstract

Materialsforthermalconductionarereviewed.Theyincludematerialsexhibitinghighthermalcon-

ductivitysuchasmetals,carbons,ceramicsandcomposites),andthermalinterfacematerialssuchas

polymer-basedandsilicate-basedpastesandsolder).ó2001ElsevierScienceLtd.Allrightsreserved.

Keywords:Thermalconduction;Thermalconductivity;Thermalpaste;Thermalcontact;Composite;Interface

1.Introduction

Thetransferofheatbyconductionisinvolvedintheuseofaheatsinktodissipateheatfroman

electronicpackage,theheatingofanobjectonahotplate,theoperationofaheatexchanger,the

meltingoficeonanairportrunwaybyresistanceheating,theheatingofacookingpanonan

electricrange,andinnumerousindustrialprocessesthatinvolveheatingorcooling.E?ective

transferofheatbyconductionrequiresmaterialssuchasaheatsinkmaterial)ofhighthermal

conductivity.Inaddition,itrequiresagoodthermalcontactbetweenthetwosurfacessuchas

thesurfaceofaheatsinkandthesurfaceofaprintedcircuitboard)acrosswhichheattransfer

occurs.Withoutgoodthermalcontacts,theuseofexpensivethermalconductingmaterialsforthe

componentsisnotcost-e?ective.Theattainmentofagoodthermalcontactrequiresathermal

interfacematerial,suchasathermalgrease,whichmustbethinsmallinthickness)betweenthe

matingsurfaces,mustconformtothetopographyofthematingsurfaceandpreferablyshould

haveahighthermalconductivityaswell.Thispaperisareviewofmaterialsforthermalcon-

duction,includingmaterialsofhighthermalconductivityandthermalinterfacematerials.

*Tel.:+1-716-645-2593,ext.2243;fax:+1-716-645-

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