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WET工艺介绍学习课件.pptx

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WETProcessIntroduction;PurposeofWetCleaningProcess;PurposeofWetCleaningProcess;WetCleaning(Pre-treatment);WetProcess;ChemicalsInvolved;Wetbench;PurposeofPre-cleanistoremovethelastunwantedoxidelayerandpreparesurfacefreeofmetalliccontaminantsandgoodPCfornextoxidation.;;EtchingoffnativeoxideleavinghydrophobicSisurface,repelsH2O,thatispronetoH2Omark

Asamethodtopassivatesurface,H2O2/SC1/SC2lastisused.

;WhatisH2Omark?;Whatistheimpactofwatermark?;;DIWtankisforrinsingwaferascleanaspossiblebeforegoingintothenextchemicaltanktopreventcross-contaminationorbeforeleavingthehood.

DIWcanoverfloworquickdumprinse(QDR).OverflowisverystableflowofDIWandgivesgoodPCcontrol.Itmakesuseofdiffusionanddilution.QDR,ontheotherhandmakesuseofextradragforcewhenDIWdumpitisfastatremovingacidtrace,butsincethereismoreagitationinthetank,itmayresultinhigherPC.ControloftheDIWtankandsurroundingcleanlinessisimportant.

DIWtankoverflowsatalltimeswithby-passflowtopreventbacteria.BacteriawillresultinPCmetalliccontamination.

;DIWcanbehotorcold-dependsonpreviousandnexttanks.

HotChemicalwillbefollowedbyHotDIW/ColdDIW;thisistopreventthermalshock.Forhighviscositychemical,HDIWrinsewillimprovesolubilityofthechemical,thusimprovethediffusionofchemicaltobulkofDIW,thisimprovestherinseefficiency.

ThereisalsotheDIWMegasonicTank(overfloworwithquickdumprinse).TheextraMegasonicpowerhelpsparticlereductionandimprovesrinsingefficiencyespeciallyforviscouschemical.

;DIWflow-rate.

ProcessTime.

DumpCycleProcessTimeforeachsequence.

MegasonicOnSequence.;;SC1withMegasonic

;ThemechanismproducingtheroughsurfaceistheNH4OHactsastheetchantoftheoxidewhileH2O2actsastheoxidant:

;Methodsofreducingthemicroroughnesscanbesummar

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