镁铜扩散偶界面扩散层显微组织研究.pdfVIP

热加工工艺2018年1月第47卷第l期

镁铜扩散偶界面扩散层显微组织研究

韩赞．杜双明

(西安干=技大学材料科学与工程学院，陕西西安710054)

摘要：片1铆钉法制衍rMgC／u几扩敞偶，行将其置于l：式炉l11上生仃扩敞反麻．利川SEMfi1EDS分忻

研究J扩敞的微组l特fili．表叫，4304450℃之间，Mg／Cu兀{_J敞偶的界面反心层fll~P,包}rMg』休扩

敝l、CuMg化合物千¨Cu琏f小扩敞lx=，{Mg基体扩敞区由d—Mg瞍沿j}分布的状MgCuⅢ成485。C

热扩4h．Mg／Cu敞f}i3的面反心IMg齄体扩散Ix：、(a—Mg+Mg!Cu)…t1c．．1l和Cu基体扩敞L盒M化

合物的』孕J随俅温时间的增人‘抛物线增K扩敝[Xl6史噬J月【显高flJf!I材，485℃以F时．硬度最大值脱fI近荆

綦．川．485。C时．扩敞J×：硬的破久ff【…脱区

关键词：MgC／u芹利，心：扩敞；咂手r澈展；lll做组：做艘f耍

DOI：10．141588．cnki．1001-3814．2018．01．0l1

中图分类号：TG1l5．21文献标识码：A文章编号：lo0卜38l4(2ol8)0l一0045—04

StudyonMicrostructureofInterfacialDiffusionLayer

ofMg／CuDiffusionCouple

HANYun，DUShuangming

(CollegeofMaterialsScienceandEngineering，Xi’anUniversityofScienceandTechnology．Xi’an710054．China)

Abstract：TheMg／CudiffusioncoupleswercpreparedbytherivetmethodandputinthetubeatmospherefiamacefL1r

di~tsionreactionThen1icI．ostructureofthedifTusionlayerwasstudiedbySEMandEDSanalysis．Theresultsshowthat

、vhenthetemperatureisin430—450℃．themicrostructureofMg／Cuinterthciall。eactionlayerismainlycomposedofMg

matrixdimlsionzone．Cu、MgcornpotmdzoneandCumatrixdiffusionzone，andtheMgmatrixdiffusionzoneconsistsof

q—MgsolidsolutionandgranularMgCuwhichdistributesalongthegrainboundaries．ThemicrostructureofMg／Cuinterfiacial

leactionlayeriscomposedofMgmatrixdiffusionzone，(d—Mg+MgCu)eutccticlayerandCumatrixdiflhsionzoneat485(’r

4l1_Withtheincreaseofholdingtime．thethicknessofintennetalliccompoundsincreasesparabolically．Thehardnessofthe

diffusionzoneishigherthanthatofthebasemetalsatb