PTH上锡技术报告-NSG.pptVIP

PTH上錫技術報告

NSG/NSD-制工部NSD最佳技術獎評比資料

大綱問題背景問題描述工程分析DOE分析效果确認生產良率總結

問題背景產品說明FabsizeLayerTopsideCompQtyBotsideCompQtyPTHCompQtyTotalCompQty15.60”x16.46”x0.125”2613371823163176TopSideBottomSide

問題描述試產階段:PTH上錫不良（不符合IPC-A-610Csec6.3).U108U109C327C329U110C1304C1306

問題描述5Dx測試PTH上錫高度--不良值(Agilent5DX-X光分層分析儀

試驗檢測2DX-ray--确診不良方位DPA(DestructivePhysicalAnalysis)切片試驗放大觀測DPA顯示上錫高度小于板厚的75%(即2.38mm)2DX-rayconfirm切片顯示U109pin6上錫不良

工程分析關聯因素Waveprocess參數.Fixture/Flux涂量.PTHPin連到接地銅薄﹐易散熱﹒

工程分析試產profile提高預熱溫度以利上錫

DOE分析WaveprocessDOE1參數設置(BeltSpeed,pre-heat)BeltSpeed(m/minute)Preheat1(oC)Preheat2(oC)HotFan(oC)SolderPot(oC)0.50350370200250PCBApreheatTempofpro:TopsideofBGA(oC)TopsideofC1305-(oC)TopsideofB1-(oC)TopsideofC1304+(oC)TopsideofC1304-(oC)TopsideofC1306-(oC5Dx上錫高度檢查結果:C1304pin1-C1304pin1+C1305pin1-C1305pin1+C1306pin1-C1306pin1+52%116%85%105%49%106%

DOE分析WaveprocessDOE2參數設置(BeltSpeed,pre-heat)BeltSpeed(m/minute)Preheat1(oC)Preheat2(oC)HotFan(oC)SolderPot(oC)0.40360380200250PCBApreheatTempofpro:TopsideofBGA(oC)TopsideofC1305-(oC)TopsideofB1-(oC)TopsideofC1304+(oC)TopsideofC1304-(oC)TopsideofC1306-(oC)1201151251191191285Dx上錫高度檢查結果:C1304pin1-C1304pin1+C1305pin1-C1305pin1+C1306pin1-C1306pin1+51%112%96%102%43%104%

DOE分析WaveprocessDOE3參數設置(BeltSpeed,pre-heat)BeltSpeed(m/minute)Preheat1(oC)Preheat2(oC)HotFan(oC)SolderPot(oC)0.37290310250250PCBApreheatTempofpro:TopsideofBGA(oC)TopsideofC1305-(oC)TopsideofB1-(oC)TopsideofC1304+(oC)TopsideofC1304-(oC)TopsideofC1306-(oC)1089410594981135Dx上錫高度檢查結果:C1304pin1-C1304pin1+C1305pin1-C1305pin1+C1306pin1-C1306pin1+47%115%88%101%41%105%

DOE3pro:DOE分析

DOE分析WaveprocessDOE4