均热板相变传热仿真分析.pdfVIP

机械工程师

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均热板相变传热仿真分析

高羡明，郑毅，张功学，任佳

（陕西科技大学机电工程学院，西安710021）

摘要：

随着高性能计算（HPC）、云计算、人工智能等行业迅猛的发展，计算机芯片的热流密度持续升高。为了保证计算机

高效、稳定的运行，对散热问题的解决提出了巨大的挑战，相变散热是一种非常有优势的散热方式，近几年受到人们广泛关

注。文中对相变散热的核心部件均热板进行研究，均热板的微槽道结构对其散热效果具有很大的影响，通过对矩形、V形、

圆弧形微槽道均热板的数值模拟仿真分析，研究其内部流体域温度、压力、速度的变化情况，发现V形槽均热板具有最好的

散热效果，矩形槽次之，圆弧U形最差；圆弧U形槽均热板的均温性最好，矩形和V形槽较差；三种微槽道结构内部流体域流

动速度较缓慢。

关键词：

均热板；相变；数值模拟；微槽道

中图分类号:TK172文献标志码:粤文章编号：员园园圆原圆猿猿猿（圆园21）11原园034原园4

SimulationAnalysisofPhaseChangeHeatTransferofVaporChamber

GAOXianmingZHENGYiZHANGGongxueRENJia

(CollegeofMechanicalandElectricalEngineering,ShaanxiUniversityofScienceTechnology,Xi’an710021,China)

Abstract:Withtherapiddevelopmentofhigh-performancecomputing(HPC),cloudcomputing,artificialintelligenceand

otherindustries,theheatfluxdensityofcomputerchipscontinuestoincrease.Inordertoensuretheefficientandstable

operationofthecomputer,ahugechallengeispresentedtothesolutionoftheheatdissipationproblem.Phasechangeheat

dissipationisaveryadvantageousheatdissipationmethod,whichhasattractedwidespreadattentioninrecentyears.This

paperstudiesthevaporchamber,thecorecomponentofphasechangeheatdissipation.Themicrochannelstructureofthe

vaporchamberhasagreatinfluenceonitsheatdissipationeffect.Throug