逻辑产品封装的热降额曲线.pdfVIP

Application

Report

May2009

SZZA013B

ThermalDeratingCurvesfor

Logic-ProductsPackages

SZZA013B

February1999−RevisedMay2009

1

Contents

TitlePage

Abstract...........................................................................................1

Introduction.......................................................................................1

Background.......................................................................................1

TheConcept.......................................................................................2

ApplicationtoSemiconductorPackaging...............................................................2

DeratingCurves.......................................................