表面组件贴装.pdfVIP

ApplicationReport

SNOA040B–August1999–RevisedApril2013

MountingofSurfaceMountComponents

ABSTRACT

Overthepastfewyears,electronicproducts,andespeciallythosewhichfallwithinthecategoryof

ConsumerElectronics,havebeensignificantlyreducedinphysicalsizeandweight.Thisdocument

providesinformationaboutthetechniquesusedtomountCSPsizecomponents.

Contents

1Introduction3

2ComponentSizeComparison3

3AcceleratedBiasMoistureTestDIP,SOs,andCSP4

4PCBAssemblyFlows4

5ChangingAssemblyTechniquesTechnologies8

5.1CombinedWaveSolderandSolderReflow8

5.2FinePitchSMSolderReflowSide1andSide28

6PurposeofSolderPaste8

6.1TypesOfSolderPasteFluxes8

7ComparisonofParticleSize/ShapeofVariousSolderPastes9

8SolderPasteForStandardSMPackages9

8.1SolderPasteForFinePitchSMPackages10

8.2WaterSolubleSolderPasteForFinePitchSurfaceMountPackages10

8.3StencilThickness10

8.4StencilMaterials10

8.5Squeegee10

8.6PrintSpeed11