层压 CSP 应用手册.pdfVIP

ApplicationReport

SNAA002E–September1999–RevisedMay2013

AN-1125LaminateCSP/FBGA

ABSTRACT

LaminatesubstratebasedCSPsatTIhavebeeninproductionforoverthreeyears.TexasInstruments

hasshippedover300millionsunitsoftheCSPtothewirelessindustryandhasofferedboththelandgrid

array(LGA)aswellasthefinepitchballgridarray(FBGA)fortheCSP.Thisisthepackagechoicefor

portableandwirelessapplications.

Contents

1Introduction3

1.1ChipScalePackages3

1.2Applications3

1.3CSPFeatures3

1.4ThermalCharacteristics3

1.5Reliability3

2CSP/FBGAOfferingList4

3CSPCrossSection5

4CSPFBGAPackages5

5StandardProcessFlow6

6MaterialProperties6

7DesignGuidelines6

8PackageReliabilityData7

8.1Precondition7

8.2ReliabilityTestConditions-ThreeLotsEach7

9ApplicationNotes7

9.1PrintedCircuitBoard(PCB)LayoutGuidelines7

9.2PackagetoBoardAssembly8

10ComponentReworkProcedures12

10.1CSPandFBGA